scieee Science in your language
[en] (orig)

A Methodology for MOS Transistor Mismatch Parameter Extraction and Mismatch Simulation

Abstract

This paper presents a methodology for mismatch parameter extraction and mismatch simulation using conventional electrical simulators, like HSpice. A measurement and extraction procedure has been carefully designed to be able to obtain reliable measurements of the mismatch parameters of a given technology. The correctness of this extraction procedure method has been checked through three different validation methods. We also present two methods for performing mismatch simulation with conventional circuit simulators (like HSpice) using the extracted parameters.

Read accessible full text

A Methodology for MOS Transistor Mismatch Parameter Extraction and Mismatch Simulation

Author: Serrano Gotarredona, María Teresa; Linares Barranco, Bernabé
Publisher: IEEE Computer Society
Year: 2000
DOI: 10.1109/ISCAS.2000.858700
Source: https://idus.us.es/bitstreams/163b95fc-0102-40f7-9f93-2f0417a5e833/download
ISCAS
2000
-
IEEE
In e na ional Symposium on Ci cui s and
Sys ems,
May
28-31,
2000,
Gene a, Swi ze land
A
Me hodology o MOS T ansis o Misma ch Pa ame e
Ex ac ion and Misma ch Simula ion
T. Se ano-Go a edona and B. Lina es-Ba anco
Na ional Mic oelec onics Cen e (CNM),
Ed.
CICA, AV. Reina Me cedes s/n,
41012
SPAIN. Phone:
34-5-4239923
Fax:
34-5-4624506, E-mail: bemabe
@
imse.cnm.es
Abs ac
This pape p esen s a me hodology o misma ch pa ame e
ex ac ion and misma ch simula ion using con en ional elec ical
simula o s, like HSpice.
A
measu emen and ex ac ion p ocedu e
has been ca e ully designed o be able o ob ain eliable
measu emen s o he misma ch pa ame e s o a gi en echnology.
The co ec ness o his ex ac ion p ocedu e me hod has been
checked h ough h ee di e en alida ion me hods.
We
also
p esen wo me hods o pe o ming misma ch simula ion wi h
con en ional ci cui simula o s (like HSpice) using he ex ac ed
pa ame e s.
I.
In oduc ion
P ecise analog
CMOS
ci cui design equi es a ailabili y
o con iden ansis o misma ch models du ing he design and
simula ion s ages. Du ing he design phase o an analog
VLSI
ci cui , designe s ace many cons ain s imposed by he design
speci ica ions, such
as
speed, bandwid h, noise, p ecision,
powe consump ion, a ea consump ion, which need o be aded
o o op imum o e all pe o mance. Designe s mus ely on
accu a e simula ion ools in o de
o
achie e
a
well op imized
inal design. Simula ion ools a e eliable as long
as
hey a e
based on good models ob ained h ough con iden
cha ac e iza ion echniques. O en i
is
no possible o simula e
p ope ly he p ecision limi s ha can be achie ed by a ce ain
ci cui opology in
a
gi en ab ica ion p ocess because
VLSI
ci cui manu ac u e s a ely p o ide ansis o misma ch
in o ma ion. T ansis o misma ch a ec s o se ol age o
di e en ial pai s, e o s in cu en mi o s, e o s in a ays o
iden ical cu en sou ces,
...
.
Elsewhe e [1],[2], we ha e p esen ed
a
e y simple and
cheap me hodology o cha ac e ize ansis o misma ch as a
unc ion o ansis o wid h and leng h plus
a
new i e
pa ame e s misma ch model ha achie es be e esul s han
o he misma ch models p e iously epo ed in li e a u e [3],[4].
In his pape , we e i y he co ec ness o his new misma ch
model and he measu emen lex ac ion p ocedu e h ough h ee
di e en alida ion me hods. Also, we p esen wo di e en
me hods o using he expe imen ally ex ac ed misma ch
ansis o pa ame e s in a con en ional elec ical simula o , like
HSpice, o p edic he o se ol age o di e en ial pai s
(o
wha e e ci cui speci ica ion we may be in e es ed a ). The
simula ed o se is compa ed e sus he expe imen ally
measu ed one, showing
a
good ag eemen be ween bo h.
Fo
misma ch cha ac e iza ion o a gi en echnology we
ab ica e a special pu pose chip in he co esponding
echnology[ 13.
Ou
chip consis s o a ma ix o
8
x
8
cells. Each
cell con ains
NMOS
and
PMOS
ansis o s o 30 di e en sizes.
Since, some ansis o s in he pe iphe y p esen la ge sys ema ic
de ia ions wi h espec o hose in he inne cells, only he la e
ansis o s whe e conside ed[5]. T ansis o pa ame e
misma ches a e ob ained by measu ing pai s o iden ical
ansis o s loca ed in adjacen cells. Since in he chip he e a e
6
x
6
e ec i e cells, he e a e
6
ows, each o which p o ides
5
pai s o adjacen cells. This esul s in 30 adjacen ansis o pai s
( o
each ansis o size and ype).
Fo
each ansis o pai , ou cu es we e measu ed. Two o
hem while ope a ing in he ohmic egion and he o he wo
o
sa u a ion (always in s ong in e sion). These cu es a e
(1)
(2)
Cu el:I,,(V,,)
,V,,
=
OV,V,,=O.l,
VGse
11.5,5.01
Cu e2:/,,(Vs,),V,,
=
3.0V,VD,
=
0.1
V,V,,
E
LO,
2.01
Cu e3:/,S(V,,5),V,,
=
OV,V,,
=4.0V,VG,E
[1.5,5.01
(3)
Cu e4:1,,(VS,),V,,
=
3.0V,V0,
=~.OV,V,,E
[O,
2.01
(4)
The ollowing s ong in e sion la ge signal ansis o model is
assumed [I]-[2],
whe e,
(
s,)
=
Vm
+
Y
I
&%-
h
I
(6)
and
VD,,,,l
is de ined as,
DS,
=
VD.5
o
ohmic
egion
(7)
V,,
-
V,( V,,)
o
sa u a ion
These cu es depend nonlinea ly on he
la ge signal
pa ame e s
o be ex ac ed
(
p,
V,,,
e,,
e,
and
y
)
as well
as
on
he measu ed da a poin s
{
V,,
)
and
{
V,,
).
The e o e, hese
la ge-signal pa ame e s
should be ex ac ed using nonlinea
mul i-pa ame e s cu e i ing echniques. Fo a gi en
ansis o pai , he misma ch in he ex ac ed
la ge-signal
pa ame e s
is
ob ained by i ing he cu en misma ch da a
AIDs/IDs
o i s heo e ical equa ion
[1]-[2],
and ex ac om i he
misma ch pa ame e s
(Ap/p,
AV,,,
AB,,
AB,,
Ay
)
simul aneously o cu es
1
o
4.
This measu emen /ex ac ion p ocedu e
is
epea ed o he
N,
=
30
ansis o pai s.
Fo
each ex ac ed
misma ch
pa ame e
AP
,
i s
s anda d de ia ion
qAP)
is
compu ed,
as
well
as
all co ela ions be ween pai s o
misma ch pa ame e s
‘(AP1.AP2)
‘
11.
Valida ion
o
he Misma ch Model
In his sec ion, we desc ibe a ew es s ha we ha e
pe o med o e i y he co ec ness o ou misma ch model and
measu emen /ex ac ion p ocedu e. The chip we ha e used o
ou measu emen s is ab ica ed in a s anda d
1.0pin
double-me al single-poly
CMOS
echnology.
A.
P ecision
Tes
A
i s es o alida e ou measu emen p ocedu e was o
measu e, epea edly he same ansis o 30 imes and ollow he
same pa ame e ex ac ion and s a is ical cha ac e iza ion
0-7803-5482-6/99/$10.00 02000
IEEE
IV-
109
p ocedu e. We ob ain
a
se o s anda d de ia ions ha gi e us an
indica ion o he e o o ou ins umen s and ma hema ical
algo i hms.
When measu ing he pa ame e
P
misma ch be ween wo
ansis o s he esul ing measu ed
AP
alue has wo
componen s,
AP
=
APR<"I
+
(9)
whe e
AP,,,,
is
he eal misma ch in pa ame e
P
be ween
bo h ansis o s and
AP,,,,,,
is an e o componen in oduced
by he measu emen se -up and pa ame e ex ac ion
p ocedu e. By epea ing many measu emen s we ob ain he
quad a ic de ia ion
because he andom ansis o misma ch and he measu emen
e o s a e supposed
o
be unco ela ed. By epea ing he same
measu emen o e he same ansis o , we measu e
B(~~,,,~,~,)
.
The alues o
(J(,~,,,~~,~
esul ed o be less han
113
o hose
o
a(Ap)
in he wo s case, and we e no mally below
1/10.
I
N,
is
he numbe o measu emen s o
a
no mally
dis ibu ed andom a iable, and hese measu emen s a e used
o compu e
a
s anda d de ia ion
o
his a iable,
a,,,,,p,,,,,~,
hen
he e is
a
con idence in e al o he eal s anda d de ia ion
(JR~~I
161
-L(Nl)
o ui ip , d
ORsol
acoiii,ii!!s /
.
(I
When
N,
=
30
he
95%
con idence in e al is
=
0.8
,
lI
=
1.3
.
In ou case
alApl
and
o(~~,,,~
ha e been
ob ained by
N,
=
30
measu emen s.
On
he o he hand, we
can de ine
a
(conse a i e) con idence in e al o
2
7
71
7,
(12)
( 11
)
x
(J&
,,,,,)
=
Inax[qAPR
(,,
))
I
=
H
x
a&)
-
;
x
0;AP
,,,(
",)
.7
,
-7
1,
( L)
X';A/',
,,,,,)
=
ninla~APRen,)l
=
;xa[AP)- ~lXa{AP
,,,,,,
!<)
By
de ining
i
ollows ha
Fig.
1
depic s he alues o and
L
as
a
unc ion o
a
when
N,
=
30.
No e ha e en o alues o
a
as
high
as
0.5
he e
is
s ill
a
easonable con idence in e al o
olAPRm,)
(app oxima ely
+
50%
).
Since, in ou case, he wo s case
a
is
less
han
1/3,
by Fig.
1
we can see ha o his wo s case,
he con idence in e al is no signi ican ly deg aded. This kind
o p ecision es is also called in he li e a u e
epea abili y
s udy
[4].
Howe e , wi h his
epea a6ili y
s udy,
he only
hing we can conclude is ha wha e e has been measu ed, i
has been measu ed wi h accep able p ecision. Bu ha does
no assu e ha he ob ained s a is ical misma ch pa ame e s
a e
a
good measu emen o he physical quan i ies
qAP)
and
hei espec i e co ela ions
(Ap,,Ap,)
.
To e i y his, o he es s
ha e o be pe o med.
B.
P edic ing
a(A,D5,,os~
o
he Measii ed Cu es
he ollowing exp ession
is
ob ained,
I we compu e he s anda d de ia ion o
a(Alns,lD,5)
in eq.(8),
20
15
10
05
00
00
01
02
03
04
05
06
07 08
09
10
a
Fig.
1:
Plo
o
k
and
as
a unc ion o
a
cu e
I.
w=*m
cu e
I.
w=*
C Ne
1.
W.lW
2345
cu e
I
w=*m
2515
08
06
04
2345
C Ne
I
w=z
4m
2
I
Fig.
2:
Simula ed (solid lines) and measu ed alues (ma ked
symbols) o
a(,ln ,,Ds)
o cu e
1
o all ansis o geome ies
Thus, using he ex ac ed misma ch pa ame e s,
o,,~,~,
,
a(,,,
,
aIAy)
,
qA8
),
a(,e
and hei co esponding co ela ion
coe T lcien s, we cin compu e he expec ed cu en misma ch
cu es Fig.
2
shows
o
he
30
geome ies o NMOS
ype ansis o s
a
compa ison be ween he measu ed
a(,, sl,osl
(ma ked wi h symbols) e sus he compu ed ones (solid ines)
o cu e
1.
An excellen ag eemen
is
obse ed o
all
cu es
1
o
4
[2].
This is al eady a e y good indica ion ha we a e ex ac ing
co ec enough misma ch pa ame e s. Al hough we a e
p edic ing he same cu es we ha e used o ex ac he misma ch
pa ame e s, he se o misma ch pa ame e s we a e ex ac ing
is
unique, alid o all
4
cu es.
Howe e ,
a
mo e se e e
es
would be o p edic o he
cu es, ob ained unde di e en bias condi ions. This
is
he es
desc ibed nex .
C.
P edic ing Di e en ial Pai s O se Vol age
In his sec ion, we use he ex ac ed s a is ical misma ch
pa ame e s o p edic he o se ol age o di e en ial pai s. To
ob ain di ec measu emen s
o
di e en ial pai s inpu ol age
o se , o each pai
o
ansis o s in ou misma ch
cha ac e iza ion chip we measu e he ollowing cu e
Ios(Vc5),
V,,
=
c e,V,,
=
~.OV,V,,E [2.99V,3.01VI1
(16)
once o each ansis o o he pai . The measu ed ansis o
a e
placed in adjacen cells loca ed
363pm
apa . Fig.
3
shows he
IV-110
2
990
2
995
3
000
3
oQ5
VP
Fig.
3:
Measu ed
o se
ol ages o
one
ai
o
NMOS
ansis o s
Table
1
measu ed poin s
o
one pai o NMOS ansis o s
o
size
40pmx40pm.
Also shown in Fig.
3
a e he co esponding
in e pola ed lines o he measu emen s
(17)
IDSI(VGS)
=
mlVGs+nl
VGs)
=
m2
VGs
+
n2
Consequen ly, he
o se
ol age o his di e en ial pai
is
gi en by
Fo each pai o ansis o s he cu es o eq.(
16)
we e measu ed
o wo di e en alues o
V,,
.
Fi s o
V,,
=
OV
(no
subs a e e ec ), and second o
Vs,
=
1
V
(wi h subs a e
e ec :
AY
is a ec ing he o se ol age). The s anda d
de ia ion
o
hese o se ol ages was compu ed o each
ansis o size and ype. Table
1,
unde he columns named
“MEASURED’, indica es he measu ed alues o
o(,~~llI)
as
a
unc ion o ansis o size and ype.
In o de o p edic he s anda d de ia ion o his o se
ol age using ou ex ac ed misma chda a, no e ha
(see
Fig.
3)
whe e
qA1
can be compu ed by e alua ing eq.(15) in
sa u a ion,
”%
lD,/s,,,
can be ca@ulaid !sing he mean
ex ac ed la ge signal pa ame e s
(p
,
V,,
,
e,
and
y
).
The
alues o
q
compu ed his way a e
also
shown in Table
1
unde he c8hmns named “COMPUTED’. No e ha he
compu ed alues s ay wi hin he con idence in e als o he
measu ed alues.
111.
Misma ch
Simula ions
The ex ac ed misma ch pa ame e s can be used in
a
con en ional elec ical ci cui simula o , like HSpice, o p edic
ci cui speci ica ions such
as
o se ol ages, e o in he ou pu
cu en o
a
cu en mi o , e c. This can be
a
e y aluable ool
o
design high pe o mance ci cui s. HSpice simula ions ha e been
pe o med in o de
o
p edic he measu ed di e en ial pai s inpu
o se
ol ages o Table
1.
We
desc ibe wo simula ion me hods,
bo h based on Mon e Ca lo simula ions.
A.Me hod
1:
In his me hod he idea is o use he ansis o model
p o ided by he manu ac u e and in oduce in o i andom
a ia ions o some o he mos misma ch sensi i e pa ame e s. In
ou case, he manu ac u e model
is
a
Le el
6
Hspice model.
Ob iously he physical meaning o he la ge signal pa ame e s
(such as
p
,
V,,
,
0
and
y
)
is di e en han o he simple model
we
assumeddu ing ou misma ch cha ac e iza ions (eqs. (5)-(6)).
Besides his, and in ou pa icula case, he manu ac u e model
does
no
include explici ly he mobili y deg ada ion pa ame e
“8”.
Consequen ly, we will use only
o(,glB,
,
qAV,,,)
and
qAY)
and
igno e
all
co ela ions. The way
o
use his misma ch model in
(H)Spice is as ollows.
Each ansis o in he ne lis is subs i u ed by
a
subci cui
call which includes
a
MOS
ansis o o he speci ied size and
whose
p
,
V,,
,
and
y
a e
ecompu ed by adding noise o hem. I
o(,~,~,
,
IS(^^,,)
,
and
qA
a e he ex ac ed misma ch pa ame e s
hen he ecompu ed alues o
p
,
V,,
,
and
y
a e,
whe e
CAW(.)
is
a
no mally dis ibu ed andom numbe
gene a ion ou ine whose
“mean”
and
‘‘sigma”
alues ha e o
be
p o ided. No e ha each de ia ion is di ided by
“h
”.
This
is because he ansis o de ined by eq.
(20)
is de ia ed wi h
espec o
a
nominal one. The HSpice inpu
ile
sec ion ha
pe o ms wha desc ibes eq.
(20)
is:
.subck mod- yp D ain Ga e Sou ce
Bulk
wid h=w
m-mod
D ain Ga e sou ce Bulk
nmos
w=w
1=1
.MODEL
NMOS
NMOS
UPDATE
=
xxx
+
LEVEL
=
6.0
WDEL
=
xxx
LATD
=
xxx
+
XL
=
xxx
+
VTO
=
o-n
TOX
=
xxx BETA
=
be ag
+
GAMMA
=
gannn=-n
VBO
=
xxx LGAMMA=
xxx
+WE
=
xxx
NWM
=
xxx
SCM
=
xxx
+xxx
leng h=l
.pa am be a-n_global- yp=xxxx
.pa am o-n-global- yp=xxxx
.pa am ga”a-n-globalL yp=xxxx
.pa am del a-be a
=
agauss(0,sigma-be a.1)
IV-Ill
I
“1,
S
Fig.
4:
Subci cui o misma ch simula ion using
Me hod
2
.pa am del a- o
=
agauss(O,sigma_ o,l)
.pa am del a-gama
=
agauss(0,sigma-gamma.1)
.pa am be a-n
=
‘be a-n-global- yp*(l+del a-be a)’
.pa am o-n
=
~ oq-global- yp+del a- o‘
.pa am gama-n
=
sgama-n-global- yp+del a-ganuna’
. ends
Using his p ocedu e he di e en ial pai s inpu o se ol ages
desc ibed in he p e ious sec ion we e simula ed o
all
ansis o sizes, wi h and wi hou subs a e e ec . The esul s
a e gi en in Table
1
unde he columns named “SIMULATED
(me hodl)”.
B.
Me hod
2:
The p e ious me hod has wo p oblems:
-
The MOS ansis o model p o ided by he manu ac u e
migh no include some o he la ge signal pa ame e s we
ha e used, like
p,
V,,
,
e
o
y
.
The physical meaning o pa ame e s
p
,
V,,
,
8
o
y
in he
MOS model p o ided by he manu ac u e (i hey a e
p esen ) is p obably di e en o he one in he model we
ha e assumed (eqs.
(5)-(6)).
The e o e,
Me hod
1
is
only
an app oxima e p ocedu e o p edic ing ansis o
misma ch, and he success o his me hod depends on how
much he ansis o model p o ided by he manu ac u e
di e s om he one we ha e assumed.
A
possible al e na i e o
o e come
hese p oblems would
be
o
subs i u e each ansis o in he ne lis by he subci cui
depic ed in Fig.
4.
The subci cui includes
3
MOS ansis o s
and a se o con olled sou ces. T ansis o
MY,,,
is
a nominal
ansis o (wi hou de ia ions) using he model p o ided by he
manu ac u e . T ansis o s
m,,,,,,
and
m,,,,,
a e modeled using
he ansis o model we ha e assumed (eqs.
(5)-(6)).
T ansis o
m,,,,,,
is
a
nominal ansis o and ansis o
in,,,,
is such ha i s
p
,
,VTo,
e
and
y
alues a e modi ied by adding andom
de ia ions. The ol age con olled ol age sou ces ha bias
ansis o s
m,,,,,,
and
md ,,
do he unc ion o copying he
e minal ol ages p esen a ansis o The cu en s
lowing h ough each ansis o a e sensed:
I,,
o
M,wA,N,
I,
o
m,
,”,,,
,
and
l2
o
md ,,
.
T ansis o
M,,,,,,
has
a
cu en
sou ce in pa allel
AI,,
whose alue a each ins an is gi en by
No e ha now we can use ou i e
misma ch pa ame e
(Ap/p,
AV,,,
,
AO,,
,
AB,,
Ay
]
model[l] o de ine he
la ge
signal pa ame e s
o
.
The goal
is
o be able
o
gene a e
o each
m I ,,
hese
5
misma ch pa ame e s
by knowing hei
s anda d de ia ions and espec i e co ela ion coe icien s.
This can be done in (H)Spice
as
ollows. Suppose ha o each
m,,*,.
ansis o we know i s
s a is ical misma ch pa ame e s.
Suppose
also,
ha o each
m,,,,
we can gene a e
5
andom
numbe s
{
xI
,
x?,
s3,
xq,
x8
]
which a e unco ela ed, ha e
ze o mean, and hei s anda d de ia ion
is
o(s,)
=
1l.h.
Using hese i e unco ela ed andom numbe s we can ob ain
i e co ela ed misma ch pa ame e s o
~n,,~,
as
ollows,
Whe e coe icien s
cij
can be ob ained by compu ing he
s anda d de ia ions o he igh and le hand side o eq.
(22)
[2].
The ad an age o his me hod is ha he e
is
comple e
independence be ween he simula o model pa ame e s ha
de ine he cu en h ough ansis o
M,w,,,
and ou model
pa ame e s (appea ing in equa ions
(5)-(6)
and ha we ex ac
expe imen ally o each echnology) ha de ine he cu en s
h ough ansis o s
in,,,,,,
and
md ,
.
The e ec o he addi ional
ansis o s
m,,,,,,
and
yie,,
is jus
o
add
a
de ia ion
AIDs
in he
cu en passing h ough he basic ansis o
M,w,4,,
ha
depends on he ope a ing poin and he ansis o geome y.
Using his se -up, and pe o ming Mon e Ca lo simula ions
o
p edic he di e en ial pai inpu o se ol ages o each
ansis o size, wi h and wi hou subs a e e ec , esul s in he
alues shown in Table
1
unde he columns named
“SIMULATED (me hod2)”. No e ha hese alues a e mo e
simila o hose shown in Table
I
unde columns. named
“COMPUTED” han he ones ob ained wi h he i s me hod
o simula ion. Howe e , he alues unde “SIMULATED
(me hod2)” and “COMPUTED” a e no iden ical. The eason
is
ha he coe icien
Io,/g,,,
o eq.
(19)
is
compu ed by he
simula o using he manu ac u e ansis o model ( h ough
ansis o
M,,,,
),
ins ead o he one we ha e assumed (i.e.,
eqs.
(5146)).
IV.
Conclusions
We ha e designed
a
new i e pa ame e s misma ch model
and
a
me hod o ex ac and s a is ically cha ac e ize he
misma ch pa ame e s o
a
gi en echnology. We ha e de eloped
h ee di e en es s in o de o alida e ou misma ch model and
measu emen lex ac ion p ocedu e. The i s es , p e iously
epo ed in li e a u e, assu es ha he measu emen and
ma hema ical compu a ions
ha e
been
done
wi h good
p ecision. The wo o he designed es s e i y he co ec ness o
he misma ch model i sel . In hese es s, we ha e achie ed an
ag eemen wi h he expe imen al esul s ha can no be ob ained
wi h he o he misma ch models p e iously epo ed in
li e a u e. Finally, we ha e p oposed wo di e en me hods o
use ou misma ch model
as
a
design
ool
in
a
con en ional
elec ical simula o . We ha e simula ed he o se ol age o
a
di e en ial pai wi h ou wo me hods and compa ed i e sus
he expe imen ally measu ed one. A e y good ag eemen
be ween simula ions and measu emen s ha e been ob ained.
V.
Re e ences
T. Semno-Go a edona and B. Lina es-Ba anco. “Sys ema ic
Wid h-and-Leng h Dependen
CMOS
T ansis o Misma ch
Cha ac e iza ion and Simula ion,”
Jou nal
o
Analog In eg a ed
Ci cui s and Signal P ocessing,
Decembe 1999.
T. Se ano-Go a edona and B. Lina es-Ba anco, “A New
Fi e-Pa ame e MOS T ansis o Misma ch Model,”
IEEE
Elec on De ice Le e s,
pp 37-39, ol. 21, Janua y 2000.
M.
J.
M.
Pelg om,
A.
C.
J.
Duinmaije ,
and
A. P. G. Welbe s,
“Ma ching P ope ies
o
MOS T ansis o ,”
IEEE Jou nd
o
Solid-S a e Ci cui s,
ol 24, Oc obe 1989, pp. 1433-1440
J.
Bas os,
Clia ac e izu ion
o
MOS
T ansis o Misina ch
. o
Analog Design,
Ph.D. Disse a ion, Ka holieke Uni e is ei
Leu en, Ap il 1998.
A. Pa aso ic,
A.
G.
And eou, and C. R. Wes ga e,
“Cha ac e iza ion
o
Sub h eshold
MOS
Misma ch T ansis o s
o
VLSI
Sys ems,‘’
Analog hi eg u ed Ci cui s
and
Signal
P ocessing,
ol.
8,
pp. 75-85, 1994.
Lenna Rade and Be il Wes e g en,
BETA Ma heina ics
Handbook.
CRC P ess, 1990.
IV-112