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A Methodology for MOS Transistor Mismatch Parameter Extraction and Mismatch Simulation

Serrano Gotarredona, María Teresa; Linares Barranco, Bernabé

Abstract

This paper presents a methodology for mismatch parameter extraction and mismatch simulation using conventional electrical simulators, like HSpice. A measurement and extraction procedure has been carefully designed to be able to obtain reliable measurements of the mismatch parameters of a given technology. The correctness of this extraction procedure method has been checked through three different validation methods. We also present two methods for performing mismatch simulation with conventional circuit simulators (like HSpice) using the extracted parameters.

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ISCAS 2000 - IEEE In e na ional Symposium on Ci cui s and Sys ems, May 28-31, 2000, Gene a, Swi ze land A Me hodology o MOS T ansis o Misma ch Pa ame e Ex ac ion and Misma ch Simula ion T. Se ano-Go a edona and B. Lina es-Ba anco Na ional Mic oelec onics Cen e (CNM), Ed. CICA, AV. Reina Me cedes s/n, 41012 SPAIN. Phone: 34-5-4239923 Fax: 34-5-4624506, E-mail: bemabe @ imse.cnm.es Abs ac This pape p esen s a me hodology o misma ch pa ame e ex ac ion and misma ch simula ion using con en ional elec ical simula o s, like HSpice. A measu emen and ex ac ion p ocedu e has been ca e ully designed o be able o ob ain eliable measu emen s o he misma ch pa ame e s o a gi en echnology. The co ec ness o his ex ac ion p ocedu e me hod has been checked h ough h ee di e en alida ion me hods. We also p esen wo me hods o pe o ming misma ch simula ion wi h con en ional ci cui simula o s (like HSpice) using he ex ac ed pa ame e s. I. In oduc ion P ecise analog CMOS ci cui design equi es a ailabili y o con iden ansis o misma ch models du ing he design and simula ion s ages. Du ing he design phase o an analog VLSI ci cui , designe s ace many cons ain s imposed by he design speci ica ions, such as speed, bandwid h, noise, p ecision, powe consump ion, a ea consump ion, which need o be aded o o op imum o e all pe o mance. Designe s mus ely on accu a e simula ion ools in o de o achie e a well op imized inal design. Simula ion ools a e eliable as long as hey a e based on good models ob ained h ough con iden cha ac e iza ion echniques. O en i is no possible o simula e p ope ly he p ecision limi s ha can be achie ed by a ce ain ci cui opology in a gi en ab ica ion p ocess because VLSI ci cui manu ac u e s a ely p o ide ansis o misma ch in o ma ion. T ansis o misma ch a ec s o se ol age o di e en ial pai s, e o s in cu en mi o s, e o s in a ays o iden ical cu en sou ces, ... . Elsewhe e [1],[2], we ha e p esen ed a e y simple and cheap me hodology o cha ac e ize ansis o misma ch as a unc ion o ansis o wid h and leng h plus a new i e pa ame e s misma ch model ha achie es be e esul s han o he misma ch models p e iously epo ed in li e a u e [3],[4]. In his pape , we e i y he co ec ness o his new misma ch model and he measu emen lex ac ion p ocedu e h ough h ee di e en alida ion me hods. Also, we p esen wo di e en me hods o using he expe imen ally ex ac ed misma ch ansis o pa ame e s in a con en ional elec ical simula o , like HSpice, o p edic he o se ol age o di e en ial pai s (o wha e e ci cui speci ica ion we may be in e es ed a ). The simula ed o se is compa ed e sus he expe imen ally measu ed one, showing a good ag eemen be ween bo h. Fo misma ch cha ac e iza ion o a gi en echnology we ab ica e a special pu pose chip in he co esponding echnology[ 13. Ou chip consis s o a ma ix o 8 x 8 cells. Each cell con ains NMOS and PMOS ansis o s o 30 di e en sizes. Since, some ansis o s in he pe iphe y p esen la ge sys ema ic de ia ions wi h espec o hose in he inne cells, only he la e ansis o s whe e conside ed[5]. T ansis o pa ame e misma ches a e ob ained by measu ing pai s o iden ical ansis o s loca ed in adjacen cells. Since in he chip he e a e 6 x 6 e ec i e cells, he e a e 6 ows, each o which p o ides 5 pai s o adjacen cells. This esul s in 30 adjacen ansis o pai s ( o each ansis o size and ype). Fo each ansis o pai , ou cu es we e measu ed. Two o hem while ope a ing in he ohmic egion and he o he wo o sa u a ion (always in s ong in e sion). These cu es a e (1) (2) Cu el:I,,(V,,) ,V,, = OV,V,,=O.l, VGse 11.5,5.01 Cu e2:/,,(Vs,),V,, = 3.0V,VD, = 0.1 V,V,, E LO, 2.01 Cu e3:/,S(V,,5),V,, = OV,V,, =4.0V,VG,E [1.5,5.01 (3) Cu e4:1,,(VS,),V,, = 3.0V,V0, =~.OV,V,,E [O, 2.01 (4) The ollowing s ong in e sion la ge signal ansis o model is assumed [I]-[2], whe e, ( s,) = Vm + Y I &%- h I (6) and VD,,,,l is de ined as, DS, = VD.5 o ohmic egion (7) V,, - V,( V,,) o sa u a ion These cu es depend nonlinea ly on he la ge signal pa ame e s o be ex ac ed ( p, V,,, e,, e, and y ) as well as on he measu ed da a poin s { V,, ) and { V,, ). The e o e, hese la ge-signal pa ame e s should be ex ac ed using nonlinea mul i-pa ame e s cu e i ing echniques. Fo a gi en ansis o pai , he misma ch in he ex ac ed la ge-signal pa ame e s is ob ained by i ing he cu en misma ch da a AIDs/IDs o i s heo e ical equa ion [1]-[2], and ex ac om i he misma ch pa ame e s (Ap/p, AV,,, AB,, AB,, Ay ) simul aneously o cu es 1 o 4. This measu emen /ex ac ion p ocedu e is epea ed o he N, = 30 ansis o pai s. Fo each ex ac ed misma ch pa ame e AP , i s s anda d de ia ion qAP) is compu ed, as well as all co ela ions be ween pai s o misma ch pa ame e s ‘(AP1.AP2) ‘ 11. Valida ion o he Misma ch Model In his sec ion, we desc ibe a ew es s ha we ha e pe o med o e i y he co ec ness o ou misma ch model and measu emen /ex ac ion p ocedu e. The chip we ha e used o ou measu emen s is ab ica ed in a s anda d 1.0pin double-me al single-poly CMOS echnology. A. P ecision Tes A i s es o alida e ou measu emen p ocedu e was o measu e, epea edly he same ansis o 30 imes and ollow he same pa ame e ex ac ion and s a is ical cha ac e iza ion 0-7803-5482-6/99/$10.00 02000 IEEE IV- 109 p ocedu e. We ob ain a se o s anda d de ia ions ha gi e us an indica ion o he e o o ou ins umen s and ma hema ical algo i hms. When measu ing he pa ame e P misma ch be ween wo ansis o s he esul ing measu ed AP alue has wo componen s, AP = APR<"I + (9) whe e AP,,,, is he eal misma ch in pa ame e P be ween bo h ansis o s and AP,,,,,, is an e o componen in oduced by he measu emen se -up and pa ame e ex ac ion p ocedu e. By epea ing many measu emen s we ob ain he quad a ic de ia ion because he andom ansis o misma ch and he measu emen e o s a e supposed o be unco ela ed. By epea ing he same measu emen o e he same ansis o , we measu e B(~~,,,~,~,) . The alues o (J(,~,,,~~,~ esul ed o be less han 113 o hose o a(Ap) in he wo s case, and we e no mally below 1/10. I N, is he numbe o measu emen s o a no mally dis ibu ed andom a iable, and hese measu emen s a e used o compu e a s anda d de ia ion o his a iable, a,,,,,p,,,,,~, hen he e is a con idence in e al o he eal s anda d de ia ion (JR~~I 161 -L(Nl) o ui ip , d ORsol acoiii,ii!!s / . (I When N, = 30 he 95% con idence in e al is = 0.8 , lI = 1.3 . In ou case alApl and o(~~,,,~ ha e been ob ained by N, = 30 measu emen s. On he o he hand, we can de ine a (conse a i e) con idence in e al o 2 7 71 7, (12) ( 11 ) x (J& ,,,,,) = Inax[qAPR (,, )) I = H x a&) - ; x 0;AP ,,,( ",) .7 , -7 1, ( L) X';A/', ,,,,,) = ninla~APRen,)l = ;xa[AP)- ~lXa{AP ,,,,,, !<) By de ining i ollows ha Fig. 1 depic s he alues o and L as a unc ion o a when N, = 30. No e ha e en o alues o a as high as 0.5 he e is s ill a easonable con idence in e al o olAPRm,) (app oxima ely + 50% ). Since, in ou case, he wo s case a is less han 1/3, by Fig. 1 we can see ha o his wo s case, he con idence in e al is no signi ican ly deg aded. This kind o p ecision es is also called in he li e a u e epea abili y s udy [4]. Howe e , wi h his epea a6ili y s udy, he only hing we can conclude is ha wha e e has been measu ed, i has been measu ed wi h accep able p ecision. Bu ha does no assu e ha he ob ained s a is ical misma ch pa ame e s a e a good measu emen o he physical quan i ies qAP) and hei espec i e co ela ions (Ap,,Ap,) . To e i y his, o he es s ha e o be pe o med. B. P edic ing a(A,D5,,os~ o he Measii ed Cu es he ollowing exp ession is ob ained, I we compu e he s anda d de ia ion o a(Alns,lD,5) in eq.(8), 20 15 10 05 00 00 01 02 03 04 05 06 07 08 09 10 a Fig. 1: Plo o k and as a unc ion o a cu e I. w=*m cu e I. w=* C Ne 1. W.lW 2345 cu e I w=*m 2515 08 06 04 2345 C Ne I w=z 4m 2 I Fig. 2: Simula ed (solid lines) and measu ed alues (ma ked symbols) o a(,ln ,,Ds) o cu e 1 o all ansis o geome ies Thus, using he ex ac ed misma ch pa ame e s, o,,~,~, , a(,,, , aIAy) , qA8 ), a(,e and hei co esponding co ela ion coe T lcien s, we cin compu e he expec ed cu en misma ch cu es Fig. 2 shows o he 30 geome ies o NMOS ype ansis o s a compa ison be ween he measu ed a(,, sl,osl (ma ked wi h symbols) e sus he compu ed ones (solid ines) o cu e 1. An excellen ag eemen is obse ed o all cu es 1 o 4 [2]. This is al eady a e y good indica ion ha we a e ex ac ing co ec enough misma ch pa ame e s. Al hough we a e p edic ing he same cu es we ha e used o ex ac he misma ch pa ame e s, he se o misma ch pa ame e s we a e ex ac ing is unique, alid o all 4 cu es. Howe e , a mo e se e e es would be o p edic o he cu es, ob ained unde di e en bias condi ions. This is he es desc ibed nex . C. P edic ing Di e en ial Pai s O se Vol age In his sec ion, we use he ex ac ed s a is ical misma ch pa ame e s o p edic he o se ol age o di e en ial pai s. To ob ain di ec measu emen s o di e en ial pai s inpu ol age o se , o each pai o ansis o s in ou misma ch cha ac e iza ion chip we measu e he ollowing cu e Ios(Vc5), V,, = c e,V,, = ~.OV,V,,E [2.99V,3.01VI1 (16) once o each ansis o o he pai . The measu ed ansis o a e placed in adjacen cells loca ed 363pm apa . Fig. 3 shows he IV-110 2 990 2 995 3 000 3 oQ5 VP Fig. 3: Measu ed o se ol ages o one ai o NMOS ansis o s Table 1 measu ed poin s o one pai o NMOS ansis o s o size 40pmx40pm. Also shown in Fig. 3 a e he co esponding in e pola ed lines o he measu emen s (17) IDSI(VGS) = mlVGs+nl VGs) = m2 VGs + n2 Consequen ly, he o se ol age o his di e en ial pai is gi en by Fo each pai o ansis o s he cu es o eq.( 16) we e measu ed o wo di e en alues o V,, . Fi s o V,, = OV (no subs a e e ec ), and second o Vs, = 1 V (wi h subs a e e ec : AY is a ec ing he o se ol age). The s anda d de ia ion o hese o se ol ages was compu ed o each ansis o size and ype. Table 1, unde he columns named “MEASURED’, indica es he measu ed alues o o(,~~llI) as a unc ion o ansis o size and ype. In o de o p edic he s anda d de ia ion o his o se ol age using ou ex ac ed misma chda a, no e ha (see Fig. 3) whe e qA1 can be compu ed by e alua ing eq.(15) in sa u a ion, ”% lD,/s,,, can be ca@ulaid !sing he mean ex ac ed la ge signal pa ame e s (p , V,, , e, and y ). The alues o q compu ed his way a e also shown in Table 1 unde he c8hmns named “COMPUTED’. No e ha he compu ed alues s ay wi hin he con idence in e als o he measu ed alues. 111. Misma ch Simula ions The ex ac ed misma ch pa ame e s can be used in a con en ional elec ical ci cui simula o , like HSpice, o p edic ci cui speci ica ions such as o se ol ages, e o in he ou pu cu en o a cu en mi o , e c. This can be a e y aluable ool o design high pe o mance ci cui s. HSpice simula ions ha e been pe o med in o de o p edic he measu ed di e en ial pai s inpu o se ol ages o Table 1. We desc ibe wo simula ion me hods, bo h based on Mon e Ca lo simula ions. A.Me hod 1: In his me hod he idea is o use he ansis o model p o ided by he manu ac u e and in oduce in o i andom a ia ions o some o he mos misma ch sensi i e pa ame e s. In ou case, he manu ac u e model is a Le el 6 Hspice model. Ob iously he physical meaning o he la ge signal pa ame e s (such as p , V,, , 0 and y ) is di e en han o he simple model we assumeddu ing ou misma ch cha ac e iza ions (eqs. (5)-(6)). Besides his, and in ou pa icula case, he manu ac u e model does no include explici ly he mobili y deg ada ion pa ame e “8”. Consequen ly, we will use only o(,glB, , qAV,,,) and qAY) and igno e all co ela ions. The way o use his misma ch model in (H)Spice is as ollows. Each ansis o in he ne lis is subs i u ed by a subci cui call which includes a MOS ansis o o he speci ied size and whose p , V,, , and y a e ecompu ed by adding noise o hem. I o(,~,~, , IS(^^,,) , and qA a e he ex ac ed misma ch pa ame e s hen he ecompu ed alues o p , V,, , and y a e, whe e CAW(.) is a no mally dis ibu ed andom numbe gene a ion ou ine whose “mean” and ‘‘sigma” alues ha e o be p o ided. No e ha each de ia ion is di ided by “h ”. This is because he ansis o de ined by eq. (20) is de ia ed wi h espec o a nominal one. The HSpice inpu ile sec ion ha pe o ms wha desc ibes eq. (20) is: .subck mod- yp D ain Ga e Sou ce Bulk wid h=w m-mod D ain Ga e sou ce Bulk nmos w=w 1=1 .MODEL NMOS NMOS UPDATE = xxx + LEVEL = 6.0 WDEL = xxx LATD = xxx + XL = xxx + VTO = o-n TOX = xxx BETA = be ag + GAMMA = gannn=-n VBO = xxx LGAMMA= xxx +WE = xxx NWM = xxx SCM = xxx +xxx leng h=l .pa am be a-n_global- yp=xxxx .pa am o-n-global- yp=xxxx .pa am ga”a-n-globalL yp=xxxx .pa am del a-be a = agauss(0,sigma-be a.1) IV-Ill I “1, S Fig. 4: Subci cui o misma ch simula ion using Me hod 2 .pa am del a- o = agauss(O,sigma_ o,l) .pa am del a-gama = agauss(0,sigma-gamma.1) .pa am be a-n = ‘be a-n-global- yp*(l+del a-be a)’ .pa am o-n = ~ oq-global- yp+del a- o‘ .pa am gama-n = sgama-n-global- yp+del a-ganuna’ . ends Using his p ocedu e he di e en ial pai s inpu o se ol ages desc ibed in he p e ious sec ion we e simula ed o all ansis o sizes, wi h and wi hou subs a e e ec . The esul s a e gi en in Table 1 unde he columns named “SIMULATED (me hodl)”. B. Me hod 2: The p e ious me hod has wo p oblems: - The MOS ansis o model p o ided by he manu ac u e migh no include some o he la ge signal pa ame e s we ha e used, like p, V,, , e o y . The physical meaning o pa ame e s p , V,, , 8 o y in he MOS model p o ided by he manu ac u e (i hey a e p esen ) is p obably di e en o he one in he model we ha e assumed (eqs. (5)-(6)). The e o e, Me hod 1 is only an app oxima e p ocedu e o p edic ing ansis o misma ch, and he success o his me hod depends on how much he ansis o model p o ided by he manu ac u e di e s om he one we ha e assumed. A possible al e na i e o o e come hese p oblems would be o subs i u e each ansis o in he ne lis by he subci cui depic ed in Fig. 4. The subci cui includes 3 MOS ansis o s and a se o con olled sou ces. T ansis o MY,,, is a nominal ansis o (wi hou de ia ions) using he model p o ided by he manu ac u e . T ansis o s m,,,,,, and m,,,,, a e modeled using he ansis o model we ha e assumed (eqs. (5)-(6)). T ansis o m,,,,,, is a nominal ansis o and ansis o in,,,, is such ha i s p , ,VTo, e and y alues a e modi ied by adding andom de ia ions. The ol age con olled ol age sou ces ha bias ansis o s m,,,,,, and md ,, do he unc ion o copying he e minal ol ages p esen a ansis o The cu en s lowing h ough each ansis o a e sensed: I,, o M,wA,N, I, o m, ,”,,, , and l2 o md ,, . T ansis o M,,,,,, has a cu en sou ce in pa allel AI,, whose alue a each ins an is gi en by No e ha now we can use ou i e misma ch pa ame e (Ap/p, AV,,, , AO,, , AB,, Ay ] model[l] o de ine he la ge signal pa ame e s o . The goal is o be able o gene a e o each m I ,, hese 5 misma ch pa ame e s by knowing hei s anda d de ia ions and espec i e co ela ion coe icien s. This can be done in (H)Spice as ollows. Suppose ha o each m,,*,. ansis o we know i s s a is ical misma ch pa ame e s. Suppose also, ha o each m,,,, we can gene a e 5 andom numbe s { xI , x?, s3, xq, x8 ] which a e unco ela ed, ha e ze o mean, and hei s anda d de ia ion is o(s,) = 1l.h. Using hese i e unco ela ed andom numbe s we can ob ain i e co ela ed misma ch pa ame e s o ~n,,~, as ollows, Whe e coe icien s cij can be ob ained by compu ing he s anda d de ia ions o he igh and le hand side o eq. (22) [2]. The ad an age o his me hod is ha he e is comple e independence be ween he simula o model pa ame e s ha de ine he cu en h ough ansis o M,w,,, and ou model pa ame e s (appea ing in equa ions (5)-(6) and ha we ex ac expe imen ally o each echnology) ha de ine he cu en s h ough ansis o s in,,,,,, and md , . The e ec o he addi ional ansis o s m,,,,,, and yie,, is jus o add a de ia ion AIDs in he cu en passing h ough he basic ansis o M,w,4,, ha depends on he ope a ing poin and he ansis o geome y. Using his se -up, and pe o ming Mon e Ca lo simula ions o p edic he di e en ial pai inpu o se ol ages o each ansis o size, wi h and wi hou subs a e e ec , esul s in he alues shown in Table 1 unde he columns named “SIMULATED (me hod2)”. No e ha hese alues a e mo e simila o hose shown in Table I unde columns. named “COMPUTED” han he ones ob ained wi h he i s me hod o simula ion. Howe e , he alues unde “SIMULATED (me hod2)” and “COMPUTED” a e no iden ical. The eason is ha he coe icien Io,/g,,, o eq. (19) is compu ed by he simula o using he manu ac u e ansis o model ( h ough ansis o M,,,, ), ins ead o he one we ha e assumed (i.e., eqs. (5146)). IV. Conclusions We ha e designed a new i e pa ame e s misma ch model and a me hod o ex ac and s a is ically cha ac e ize he misma ch pa ame e s o a gi en echnology. We ha e de eloped h ee di e en es s in o de o alida e ou misma ch model and measu emen lex ac ion p ocedu e. The i s es , p e iously epo ed in li e a u e, assu es ha he measu emen and ma hema ical compu a ions ha e been done wi h good p ecision. The wo o he designed es s e i y he co ec ness o he misma ch model i sel . In hese es s, we ha e achie ed an ag eemen wi h he expe imen al esul s ha can no be ob ained wi h he o he misma ch models p e iously epo ed in li e a u e. Finally, we ha e p oposed wo di e en me hods o use ou misma ch model as a design ool in a con en ional elec ical simula o . We ha e simula ed he o se ol age o a di e en ial pai wi h ou wo me hods and compa ed i e sus he expe imen ally measu ed one. A e y good ag eemen be ween simula ions and measu emen s ha e been ob ained. V. Re e ences T. Semno-Go a edona and B. Lina es-Ba anco. “Sys ema ic Wid h-and-Leng h Dependen CMOS T ansis o Misma ch Cha ac e iza ion and Simula ion,” Jou nal o Analog In eg a ed Ci cui s and Signal P ocessing, Decembe 1999. T. Se ano-Go a edona and B. Lina es-Ba anco, “A New Fi e-Pa ame e MOS T ansis o Misma ch Model,” IEEE Elec on De ice Le e s, pp 37-39, ol. 21, Janua y 2000. M. J. M. Pelg om, A. C. J. Duinmaije , and A. P. G. Welbe s, “Ma ching P ope ies o MOS T ansis o ,” IEEE Jou nd o Solid-S a e Ci cui s, ol 24, Oc obe 1989, pp. 1433-1440 J. Bas os, Clia ac e izu ion o MOS T ansis o Misina ch . o Analog Design, Ph.D. Disse a ion, Ka holieke Uni e is ei Leu en, Ap il 1998. A. Pa aso ic, A. G. And eou, and C. R. Wes ga e, “Cha ac e iza ion o Sub h eshold MOS Misma ch T ansis o s o VLSI Sys ems,‘’ Analog hi eg u ed Ci cui s and Signal P ocessing, ol. 8, pp. 75-85, 1994. Lenna Rade and Be il Wes e g en, BETA Ma heina ics Handbook. CRC P ess, 1990. IV-112