A charge correction cell for FGMOS-based circuits
Abstract
This paper describes a novel cell used in circuits with Floating Gate MOS transistors (FGMOS) to compensate variations in the device effective threshold voltages caused by the trapped charge at the floating gate. The performance of the circuit is illustrated with experimental results showing a residual error below 1%. This coarse compensation makes possible to reduce charge effects to the same order of magnitude than the conventional mismatching in normal MOS transistors.
Full text
Abs ac
This pape desc ibes a no el cell used in ci cui s wi h
Floa ing Ga e MOS ansis o s (FGMOS) o compensa e
a ia ions in he de ice e ec i e h eshold ol ages caused
by he apped cha ge a he loa ing ga e. The pe o mance
o he ci cui is illus a ed wi h expe imen al esul s showing
a esidual e o below 1%. This coa se compensa ion makes
possible o educe cha ge e ec s o he same o de o
magni ude han he con en ional misma ching in no mal
MOS ansis o s.
Key wo ds: FGMOS analog ci cui s, Floa ing ga e cha ge
co ec ion.
1. In oduc ion
Impo an d i e s o mic oelec onics in he las yea s
has been low powe and low ol age po able sys ems
ma ke . The in e es o IC designe s has ocused in he
de elopmen o digi al and analog echniques in ended o
minimize bo h powe and ol age supply. Among he
analog me hods, he use o he Floa ing Ga e MOS
ansis o has eme ged as one o he mos p omising and
challenging as well [1]. Wo king wi h FGMOS o ces
designe s o ackle wi h se e al p oblems ela ed o he
exis ence o he loa ing node. One o i s main
sho comings in he low ol age and low powe con ex has
o do wi h he cha ge ha can s ay apped a he loa ing
ga e du ing he ab ica ion p ocess. This pape p oposes a
ou - ansis o cell which compa es he h eshold ol age
o a no mal MOS de ice wi h he one o an iden ical sized
FGMOS and p o ides an ou pu depending on he alue o
he apped cha ge. Connec ing i o he FGMOS ansis o s
in he ci cui , he change o hei h eshold ol ages caused
by ha e m can be compensa ed. Sec ion 2 will desc ibe
he mos common used echniques o apped cha ge
e asing/p ocessing in FGMOS ci cui s. In Sec ion 3, ou
p oposed ci cui is in oduced and a p ac ical ealiza ion is
epo ed whose expe imen al beha iou is explained in
Sec ion 4.
2. Cha ge Induced Co ec ion Techniques
One o he d awbacks o he use o FGMOS ansis o
has is ha he quan i y o cha ge apped a i s ga e du ing
he ab ica ion p ocess is unknown. This cha ge could be
ei he an ad an age o a disad an age depending on he
applica ion he ansis o is going o be used. The solu ions
designe s ha e adop ed o dealing wi h his p oblem could
be classi ied in: solu ions o ien ed o con ol ha cha ge, as
he unc ionali y o he ci cui is based on i s exac alue,
and solu ions ying o e ase i , since i s p esence could
spoil he block pe o mance. The mos ele an echniques
a e: 1) The use o he unnel e ec and he ho elec on
injec ion [2], [6]. 2) The applica ion o Ul aViole Ligh
(UV) o cha ge cleaning [3], [4]. 3) Fixing an ini ial
elec ical condi ion a he loa ing ga e [5].
The i s echnique con ols he cha ge ei he posi i e o
nega i e. The use o bo h p ocesses ( unnelling and ho
elec on injec ion) allows inc emen o dec emen o
cha ge. They could also be combined wi h he aim o
e asing, bu ha would b ing se e al added d awbacks as
A Cha ge Co ec ion Cell o FGMOS-based Ci cui s
Es he O. Rod íguez-Villegas, Albe o Yú e a, Ado ación Rueda
Ins i u o de Mic oelec ónica de Se illa (IMSE-CNM), Uni e sidad de Se illa,
Edi icio CICA, c/ Ta ia s/n, 41012-SEVILLA, SPAIN.
emails: [email p o ec ed], { ueda, yu e a}@imse.cnm.es
o example he need o addi ional ci cui y as well as he
use o high ol ages. Besides, hey a e no modelled in all
he echnologies. Hence, he i s s ep would be o model
hem, and his is no a simple ask. Only a ew designe s
ha e done i o ce ain echnologies [1].
The cleaning wi h ul a iole ligh is based on he ac
ha when he su ace o any semiconduc o is ligh ened
wi h ligh o any o he elec omagne ic adia ion, pa o i
is e lec ed, pa o i is abso bed, and he es is
ansmi ed. The numbe o abso bed pho ons is
p opo ional o he o al numbe o hem, and he e o e o
he ligh in ensi y. I also depends on he kind o
semiconduc o , wa e leng h o he pho ons and he applied
elec ic ield. When he loa ing ga e is ligh ened wi h UV
ligh , he elec ons apped a he ga e can a el h ough he
po en ial ba ie in he in e ace Oxide/Silicon. The main
d awback his echnique has is ha i depends on he kind
o passi a ion making mo e o less easy o elimina e he
cha ge. Howe e , his is he simples me hod as no ex a
ci cui y is equi ed.
The hi d echnique is e y use ul in ce ain examples
bu i is no as gene al as he UV cleaning. I consis s o
sho -ci cui ing he loa ing ga e o a ce ain alue (VFG(0))
ha would se he wished ope a ing poin o a ce ain
combina ion o inpu s. I would e ol e o a high impedance
s a e a e wa ds [5].
This echnique has a lo o de ac o s among some
FGMOS designe s who hink he ga e is no loa ing any
mo e. Ha ing a swi ch accessing o i has he d awback
ha , e en when his is in a high impedance s a e, he e is a
leakage cu en lowing h ough he swi ch ha will
discha ge he loa ing ga e a e some ime. I would be
needed o e esh he ga e wi h a ce ain equency, in he
o de o kHz. This would no ha e o be a p oblem in digi al
cells ha ca y ou a lo o ope a ions in ha ime. In analog
ci cui s i is no easy o use, hough, as an adequa e ese
con igu a ion has o be ound which makes he ci cui
e ol es as enough a e wa ds.
3. The Ci cui o Cha ge E o Sensing and
Co ec ion
A Floa ing Ga e MOS ansis o (FGMOS)isaMOS
ansis o whose polysilicon ga e, comple ely w apped in
silicon dioxide, has no DC pa h o a ixed po en ial. I can
modula e he channel be ween a sou ce and d ain and
he e o e i can be used in compu a ion. The coupling
capaci o s o he loa ing ga e becomes e ec i e ga es o
he de ice, depending he ga e s eng h upon he capaci o
size [7]. This is ma hema ically desc ibed by eq.(1) which
ep esen s he ol age a he loa ing ga e in an N-inpu
FGMOS ansis o , whose inpu capaci ances and ol ages
a e Ciand Vi, espec i ely, and CGD,CGS and CGB a e he
capaci i e couplings o he o he e minals: d ain, sou ce
and bulk. CTis he alue o he o al capaci ance seen om
he loa ing ga e.
(1)
being,
(2)
The las e m in eq.(1) akes in o accoun he
con ibu ion o he ga e ol age o he cha ge ha can s ay
apped on i du ing he ab ica ion p ocess. I his
exp ession is mapped o he ga e ol age in he cu en law
o a no mal MOS ansis o he new equa ions o he
FGMOS a ise, in which he e m QFG/CTcan be associa ed
o he nominal h eshold ol age, and a new e ec i e one
can be de ined. The la e di e s o he same pa ame e o
VS
VD
VB
Vn
V2
V1
VFG(0)
Fig. 1. Technique o se he ini ial condi ions a
he loa ing ga e.
VFG
Ci
CT
------- Vi
CGB
CT
-----------VB
++
i1=
N
∑
=
CGD
CT
----------- VD
CGS
CT
---------- VS
QFG
CT
-----------
+++
CTCi
i1=
N
∑CGB CGD CGS
+++=
an iden ical MOS ansis o whene e his e m is di e en
om ze o.
The ci cui p esen ed in his pape o cha ge sensing
and co ec ion is d awn in Fig. 2. The basic idea elies on
he compa ison be ween he ga e ol ages o wo
ansis o s, a MOS and a FGMOS, wi h equal aspec a ios
(M1 and M2, espec i ely). I he d ain cu en is he same
in bo h, he ga e ol age will also be he same. A e a ew
basic manipula ions, i he ansis o pai s M1-M2 and M3-
M4 a e iden ical and he de ia ions in he h eshold
ol ages (V h) and cu en ac o (β) o igina ed by
misma ching a e negligible, he VFG2 ol age a he loa ing
ga e o M2 can be exp essed as:
(3)
Subs i u ing he le hand side in eq.(3) by i s exp ession as
unc ion o he ansis o ’s e minal ol ages, he alue o
he apped cha ge a he loa ing ga e could be ob ained as:
(4)
being CGD he ga e o d ain capaci ance o ansis o M2
and Vou 2o ep esen s he alue o Vou 2’s in absence o
apped cha ge. Hence, i and
, o , . The linea
ela ionship in eq.(4) makes possible o sense ∆Qcha ge by
means o a s aigh line cu e. This p ocess is shown in Fig.
3 o he wo s aigh line pa ame e s: slope (m) and o igin
coo dina e (b).
Fo a cons an ol age Vin, he de ia ion o Vou 2 om
i s expec ed nominal alue is:
(5)
This means ha he induced cha ge e o can be measu ed
as a ol age inc emen in he ou pu e minals. Le us
conside now he ci cui in Fig. 4. All he ansis o s ha e
he same sizes, and he inpu capaci ances ha e he same
alues in he wo FGMOS. One o he inpu s in he wo
FGMOS ansis o s (M2 and M5) is connec ed o Vou 2. The
o he h ee a e connec ed o Vin, bu hey could in gene al
ha e di e en ol ages. I we Conside ha he ∆Qinduced
e o is he same in M2 and M5 and he ol age a he
loa ing ga e o he second FGMOS ansis o , VFG5, hen:
(6)
which has a nominal alue, VFG5o, gi en by he i s wo
e ms o he igh hand side in eq.(6), and an e o e m
which is cancelled hanks o he connec ion o he ou pu o
he p e ious block (eq.(5)):
(7)
The ou pu o his block will be he ol age VG6. I s alue
will sense he ol age a VFG5. Hence he e o due o he
apped cha ge a a loa ing ga e can be co ec ed by
connec ing he ansis o o he ou pu o a block like he
VFG2Vin
≈
∆Q
Cox
--------- Vin
Cin
CT
---------Vin
Cou CGD
+()
CT
-------------------------------------Vou 2=––≈
1
Cin
CT
---------
–
Vin
Cou
CT
------------
CGD
CT
------------
+
Vou 2o∆Vou 2
+()–
CGD CGS CGB
,, Cou
«
Cou Cin
=∆Q0=Vou 2oVin
≈
Fig. 2. Basic ci cui o sensing he apped
cha ge.
V
in
M1 M2
M3 M4
V
DD
V
ou 2
(C
ou
)
(C
in
)
Fig. 3. G aphic ep esen a ion o eq. (4) o ex ac
∆
Q
ela ed pa ame e alues.
Vou 2
Vin
b
∆Q
Cox
----------
–
Cin
CT
---------
CGD
CT
-------------+
------------------------------=
m
1
Cin
CT
---------
–
Cin
CT
---------
CGD
CT
-------------+
------------------------------=
∆Vou 2
CT
Cin
-------- ∆Q
Cox
---------
–≈
VFG5
3Cin
CT
----------- Vin
Cin
CT
-------- Vou 2o
Cin
CT
-------- ∆Vou 2
∆Q
CT
--------
++ +==
VFG5o∆VFG5VG6
=+
∆VFG5
∆Q
Cox
---------1Cin
Cin
--------
–
≈0=
one in Fig. 4, in he way ha has been p e iously p esen ed.
The ansis o s in his block ha e o be designed wi h he
same aspec a io as he one’s whose de ia ions a e wan ed
o be co ec ed, and he inpu capaci ances mus be much
la ge han he ga e o d ain pa asi ic.
4. Expe imen al Resul s
To p o e his idea, a ci cui p o o ype has been
ab ica ed and es ed. This p o o ype consis s in wo
ci cui s: one wi h he con igu a ion in Fig. 4, and ano he
wi h he schema ic in Fig 5. The mic o pho og aph o he
chip is shown in Fig. 6. I has been ab ica ed in a 0.8µm,
double polysilicon CMOS echnology. Aspec - a ios o
NMOS ansis o a e (W/L)=(4µm/1µm), while inpu
capaci o s a e equals o 100 F. In he es p ocess, o he
i s con igu a ion, Vin is se o 1.5V. The loa ing-ga e
ol age alues a e sensed h oughou he ga es o M2 and
M6, gi ing he Vou 2 and VG6 signals. The M4 and M7
ansis o s a e equals, so load e ec is he same. The alues
ob ained o he ou pu ol ages a e Vou 2 =V
G6 =1.03V.
These a e nea ly equal, so hese means ha ∆Qis e y low
o his un o echnology. Ci cui in Fig. 5se es us o
p o e eq. (5). A ol age signal, Ve o , has been connec ed
o one o he inpu ga es o M2 and M5. This allows o
gene a e an equi alen e o on bo h ansis o ha will
ep oduce he ∆Qe ec s. The esponses o he wo ci cui s
a e shown in Fig. 7. I can be no iced how Vou 2 is a ec ed
by his e o while VFG6 is nea ly cons an , and equal o he
alue measu ed be o e. This p o es he e o co ec ion
mechanism. The VG6 ol age changes only 1% a ound
1.03V when Ve o goes om 0.4V o 1.5V.
The p oposed cell can be used o cha ge con ol in
con inuous ime FGMOS based il e s, as o example he
epo ed in [8]. Figu e 8 shows he FGMOS e sion o a
ansconduc o . Cha ge apped a each M1 and M2
ansis o s can be cancelled by adding an ex a inpu and
connec ing i o he p oposed cell in his pape . The esul s
o his applica ion example will be shown a he
con e ence (o a he inal e sion o he pape ).
Vin M1 M2
M3 M4
VDD
Vou 2
M6
M5
M8M7
V
G6
VDD VDD VDD
Fig. 4. Ci cui o sensing and compensa ing he
apped cha ge e ec s.
Fig. 5. ∆
Q
simula ion e o ci cui by means o
Ve o
signal in he p oposed con ol es ci cui .
Ve o
Vin M1 M2
M3 M4
VDD
Vou 2
M6
M5
M8M7
V
G6
VDD VDD VDD
Fig. 6. Mic opho og aph o cha ge con ol
ci cui .
5. Conclusions
A ou - ansis o cell, in ended o coa sely co ec
e ec i e h eshold ol age o se s due o apped cha ge
du ing he ab ica ion p ocess in he FGMOS ansis o s has
been p esen ed in his pape . I s unc ionali y has been
p o en The esidual e o a e applying he co ec ion
mechanism become smalle han 1% he alue o he ini ial
induced e o e m in FGMOS de ices wi h W/L=4µm/1µm
and inpu capaci ances in he o de o 100 F.
6. Re e ences
[1] P. Hasle and T. S. Lande: “Special Issue on Floa ing-Ga e
De ices, Ci cui s, and Sys ems,” IEEE T ansac ion on
Ci cui s and Sys ems, Pa II: Analog and Digi al Signal
P ocessing, ol. 48, n. 1, Jan., 2001.
[2] M. Lenzlinge and E. H. Snow, “Fowle -No dheim
unneling in o he mally g own SiO2”, J. Appl. Phys.,
ol.40, no.1, pp. 278-283, 1969.
[3] L. A. Glasse , “A UV w i e-enabled PROM,” Chapel Hill
Con e ence on VLSI (1985), H. Fusch, El. Rock ille, MD:
Compu e Science P ess, pp.61-65, 1985.
[4] D. A. Ke ns, J. Tanne , M. Si ilo i, and J. Luo, “CMOS
UV-w i able non- ola ile analog s o age,” Ad anced
Resea ch in VLSI, C. H. Sequin, Ed. Camb idge, MA:MIT
P ess, pp. 245-261, Uni. o Cali o nia San a C uz, 1991.
[5] K. Ko ani, T. Shiba a, M. Imai, T. Ohmi, “Clock-Con olled
Neu on-MOS Logic Ga es,” IEEE T ansac ions on Ci cui s
and Sys ems-II: Analog and Digi al Signal P ocessing,
ol.45, pp. 518-522, Ap . 1998.
[6] P. Hasle , “Founda ions o lea ning in analog VLSI,” Ph.D.
Disse a ion, Cali o nia Ins i u e o Technology, Pasadena,
CA, 1997.
[7] E. Rod íguez-Villegas: “Low Vol age and Low Powe
Analog and Digi al Design wi h he Floa ing Ga e MOS
ansis o (FGMOS),” Ph.D. Thesis, U. o Se ille, Sep.
2002.
[8] E. Rod íguez-Villegas, A. Rueda, A. Yú e a. “A 1.5V
23MHz Low Powe FGMOS Fil e ” In e na ional
Con e ence on Elec onics, Ci cui s and Sys ems
(ICECS’2001), pp. 337-340, 2001.
[9] B. A. Minch, “Analysis, Syn hesis, and Implemen a ion o
Ne wo ks o Mul iple-Inpu T anslinea Elemen s,” Ph. D.
Thesis, Cal ech, Pasadena, CA, 1997.
1.4
1.41
1.42 1.43
1.44 1.45
1.46 1.47
1.48
1.49 1.5
0.8
0.85
0.9
0.95
1
1.05
1.1
1.15
1.2
V
ou 2
V
G6
1.2
0.8
1.0
Vol age (V)
0.4 1.50.9
(050mV/di )
Ve o (V)
(50mV/di )
Fig. 7. E olu ion o
Vou 2
and
VG6
when a ol age
signal (
Ve o
) is applied o simula ing a ∆
Q
cha ge on
M2
and
M6
loa ing ga es.
VCM
V
CM
V
DD
gnd
Vi2
VCM
V
DD
V
CM
VCM
V
CM
V
DD
gnd
Vi1
VCM
V
DD
V
CM
ISS
Fig. 8.
FGMOS
-based T ansconduc o .
I1I2
Vou
M
1
M
2
V
DD
V
DD