scieee Open visual document viewer

The measurement of high-temperature expansion as the standard of estimation the knock-out properties of moulding sands with hydrated sodium silicate

Major-Gabryś, Katarzyna

Abstract

The necessity of receiving high quality castings forces undertaking research to elaborate moulding and core sands ensuring obtaining the materials with relevant technological parameters and also with high environmental standards. The most important group here are moulding sands with hydrated sodium silicate. Unfortunately, their fundamental disadvantages are weak knock-out properties. The article presents the most commonly used methods of measuring the knock-out properties of moulding and core sands. The authors propose a new method for estimation this parameter. The method is based on the measurement of high-temperature expansion.

Full text

ARCHIVES OF METALLURGY AND MATERIALS Volume 59 2014 Issue 2 DOI: 10.2478/amm-2014-0123 K. MAJOR-GABRYŚ∗, S.M. DOBOSZ∗, P. JEL´ INEK∗∗ , J. JAKUBSKI∗, J. BE ˇ NO∗∗ THE MEASUREMENT OF HIGH-TEMPERATURE EXPANSION AS THE STANDARD OF ESTIMATION THE KNOCK-OUT PROPERTIES OF MOULDING SANDS WITH HYDRATED SODIUM SILICATE POMIAR EKSPANSJI WYSOKOTEMPERATUROWEJ JAKO KRYTERIUM OCENY WYBIJALNOŚCI MAS FORMIERSKICH Z UWODNIONYM KRZEMIANEM SODU The necessi y o ecei ing high quali y cas ings o ces unde aking esea ch o elabo a e moulding and co e sands ensu ing ob aining he ma e ials wi h ele an echnological pa ame e s and also wi h high en i onmen al s anda ds. The mos impo an g oup he e a e moulding sands wi h hyd a ed sodium silica e. Un o una ely, hei undamen al disad an ages a e weak knock-ou p ope ies. The a icle p esen s he mos commonly used me hods o measu ing he knock-ou p ope ies o moulding and co e sands. The au ho s p opose a new me hod o es ima ion his pa ame e . The me hod is based on he measu emen o high- empe a u e expansion. Keywo ds: moulding sand, hyd a ed sodium silica e, knock-ou p ope ies Po zeba uzyskiwania wysokiej jakości odlewów wymusza podejmowanie p ac badawczych dla o zymania mas o mie - skich i dzeniowych zapewniających uzyskanie wo zyw o odpowiednich pa ame ach echnologicznych, jednocześnie speł- niających wysokie wymogi och ony ś odowiska. Najważniejszą g upę s anowią u aj masy z uwodnionym k zemianem sodu. Nies e y jedną z ich pods awowych wad jes słaba wybijalność. W a ykule zos ały p zeds awione najczęściej s osowane me ody pomia u wybijalności mas o mie skich i dzeniowych. Au o zy zap oponowali nową me odę oceny wybijalności opie ającą się na pomia ze ekspansji wysoko empe a u owej. 1. In oduc ion The necessi y o ecei ing high quali y cas ings o ces unde aking esea ch o ob ain moulding and co e sands p o- iding o ob ain ma e ials wi h ele an echnological pa a- me e s and also wi h high en i onmen al s anda ds. Many na- ional and o eign scien i ic cen e s [1-12] unde ake scien i ic esea ch aiming o elabo a e new binding sys ems based on non oxic ino ganic binde s. The mos impo an g oup he e a e moulding sands wi h hyd a ed sodium silica e. Un o u- na ely hei main disad an age a e low knock-ou p ope ies and low abili y o mechanical eclama ion. Fo es ima ion o ac ions imp o ing moulding sands’ knock-ou p ope ies i ’s undamen al o use he app op ia e measu emen p ocedu e. In he a icle he e a e p esen ed he mos commonly used me hods o measu ing he knock-ou p ope ies o moulding and co e sands. The e is also p oposed a new me hod based on measu ing high- empe a u e expansion o es ed moulding sands. 2. Knock-ou p ope ies o moulding and co e sands The knock-ou p ope ies a e de ined as moulding o co e sand’s abili y o easy smashing ou (pou ing ou ) om mould (moulding sand) o om cas (co e sand) a e cooling he cas o knocking-ou empe a u e [13]. The knock-ou p ope - ies a e es ima ed by echnological me hods and acco ding o e ained s eng h R k cmeasu emen . 2.1. Technological me hods – he me hod ecommended by Polish S anda d no PN-85/H-11005 In echnological me hod ecommended by Polish S an- da d he e a e used s anda d cylind ical samples (ø50×50 mm) p epa ed om es ed moulding sand [13]. The samples a e ea ed exac ly as moulds and co es being p oduced om he es ed sand. The samples a e no co e ed wi h any p o ec i e coa ings. The samples (co es) a e pu inside he mould wi h usage o special model (sample ). The liquid ound y alloy is pou ed in o he mould. The alloy empe a u e should be he same as i is while p oducing cas s in es ed moulding sand. A e cooling he cas o ambien empe a u e, i is pu – wi h he samples (co es) – in de ice LUW-C o LUW-CA (au o- ∗AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY, FACULTY OF FOUNDRY ENGINEERING, DEPARTMENT OF MOULDING MATERIALS, MOULD TECHNOLOGY AND FOUNDRY OF NON-FERROUS METALS, AL. A. MICKIEWICZA 30, 30-059 KRAKOW, POLAND ∗∗ VSB – TECHNICAL UNIVERSITY OF OSTRAVA, FACULTY OF METALLURGY AND MATERIAL ENGINEERING, DEPARTMENT OF METALLURGY AND FOUNDRY ENGINEERING, CZECH REPUBLIC B ough o you by | Technicka Uni e zi a Os a a Au hen ica ed Download Da e | 12/10/14 3:01 PM 740 ma ically) cons uc ed o measu e moulding sand’s knock-ou p ope ies. The de ice is equipped wi h a pin which knocks he sample (co e) ou he cas . The wo k o one pin bea is 1,63 J [13]. The knock-ou measu emen is he wo k necessa y o mo ing he sample (co e) ou he cas . I is calcula ed om he o mula 1 [13]. Lw=1,63 ·n;J(1) whe e: 1,63 – wo k o one weigh bea , J, n – numbe o weigh bea s ill mo ing he co e ou he cas . The e a e also used o he echnological me hods o mea- su ing moulding sands knock-ou p ope ies including Russian and F ench es s [13]. 2.2. The me hod based on e ained s eng h R k c measu emen The me hod is based on measu emen o e ained s eng h R k cchange o moulding sand wi h hyd a ed sodium silica e wi h empe a u e inc easing. The es begins wi h measu ing s eng h o moulding sand in ambien empe a u e, hen – beginning in 100◦C – he empe a u e is inc easing and he s eng h is being measu ed a e e e y 100◦ ill eaching he empe a u e 1000◦C. A e cooling he samples o ambien empe a u e he e ained s eng h (R k c) o es ed moulding sand is measu ed. The esul s a e pu on he g aph show- ing he in luence o empe a u e on moulding sand’s e ained s eng h (R k c). Acco ding o he eached g aph i ’s possible o es ima e he moulding sand’s knock-ou p ope ies. Good knock-ou p ope ies has he pa o moulding sand hea ed o he empe a u e in which i s e ained s eng h (R k c) is he lowes and he pa o moulding sand hea ed o he empe a u e in which i s e ained s eng h (R k c) is high cha ac e izes wi h bad knock-ou p ope ies [13]. 2.3. The cu e o e ained s eng h (R k c) o moulding sand wi h hyd a ed sodium silica e The e a e h ee ex eme poin s on ypical cu e o e- ained s eng h (R k c) o moulding sand wi h hyd a ed sodium silica e: –The 1s maximum in he empe a u e o abou 200◦C, –The minimum in he empe a u e o abou 600oC, –The 2nd maximum in he empe a u e o abou 800◦C. Mos o he au ho s [13, 15] explain occu ing he 1s maxi- mum as he esul o binde dehyd a ion p ocess and he main ole is assigned o he dehyd a ion o unbound hyd a ed sodi- um silica e. The au ho [15] explains occu ing he 1s max- imum acco ding o DTA cu e o hyd a ed sodium silica e. The cu e shows ha in he ange o empe a u e 350-400◦C begins endo he mic p ocess wi h endo he mic peak egis e ed in he empe a u e o 600◦C. The analysis p o ed he p es- ence o wo endo he mic peaks in empe a u es o 130 and 640◦C is p obably esponsible o he compound dehyd a ion p ocess. Acco ding o he au ho [15] in case o sel ha dened moulding sands p epa ed in es e echnology he 1s maxi- mum doesn’ occu – he e is cons an dec ease o e ained s eng h beginning wi h high alues in ambien empe a u e o he minimum in empe a u e o 600◦C [15]. T ans o ma ion o qua z βα conside ed p e iously as he cause o occu ing he minimum (600◦C) acco ding o he au ho [15] can’ be he only eason o occu ing his ex eme. The au ho p o ed ha moulding sands wi h hyd a ed sodium silica e based on zi conium sand g ains has he minimum in his empe a u e as well. The minimum was also eached by es ing he s eng h o bound hyd a ed sodium silica e wi hou sand g ains. The au ho sugges s ha he e a e di e en ac o s causing his ex eme which a e among all – dehyd a ion p ocesses o dis- odium silica e and silicic acid gel [15]. A e he minimum he e is a apid inc ease o e ained s eng h wi h he max- imum in he empe a u e o 800-900◦C. The 2nd maximum is caused by o ma ion o he liquid phase (mel ing he hy- d a ed sodium silica e) and by he eac ion o Na2CO3wi h SiO2ending wi h o ma ion o Na2O·2SiO2[15]. Beyond he 2nd maximum he e is a apid dec ease o e ained s eng h (R k c) wha J.L. Lewandowski [13] explains as a esul o he iola ion o he binde shell s uc u e on qua z sand g ains, caused by a la ge change in olume o qua z. In he p esence o Na2O con e sion o c is obali e can begin al eady abo e 800◦C. 2.4. The p oposal o new me hod o knock-ou p ope ies’ es ima ion As i was ini ially e e ed in he p e ious pa o he a - icle, he me hod o es ima ion o he knock-ou p ope ies o moulding sands based on e ained s eng h (R k c) measu emen can’ be used in whole empe a u e ange. The use o e ained s eng h measu emen o es ima ion he knock-ou p ope ies o moulding sands is no clea . The au ho [15] p o ed ha moulding sand’s expansion is espon- sible o e ained s eng h dec ease beyond he 2nd maximum. The p ocess is caused by ansi ion o α-SiO2phase in o c is obali e which is ca alyzed by Na+ions, qua z densi y de- c eases om 2650 o 2330 kg/m3wi h inc easing he mass olume o abou 40%. Despi e his moulding sand’s e ained s eng h is low in empe a u es highe han 1000◦C. The au- ho [15] p o ed ha he e is he ypical 2nd maximum in he empe a u e o abou 800◦C on e ained s eng h o mould- ing sands wi h hyd a ed sodium silica e and es e ha dene s cu e, bu he ene gy necessa y o knocking he sample ou while using echnological me hod inc eases ill 1000◦C. The phenomena is caused by c is obali ic qua z sand expansion which is mainly esponsible o e ained s eng h dec ease be- yond he 2nd maximum, inc eases he inal moulding sand’s densi y causing wo se knock-ou p ope ies. Acco ding o his, au ho s o he pape elabo a ed a new me hod o es ima ion o moulding sand’s knock-ou p ope ies. The base was he analysis o co es o moulds beha io du ing pou ing p ocess – he p ocess causes moulding sand expan- sion. Howe e his phenomena is inhibi ed by cas su ace (co e sands) o by cas and moulding box (moulding sands). S ong in e nal s ess occu s in moulding sand which inhibi s i s e acua ion om he cas o om he moulding box. The highe in e nal s ess is he wo se knock-ou p ope ies a e. Moulding sand expansion measu emen a e pou ing p ocess may be use ul o es ima ion o moulding sand’s knock-ou p ope ies. B ough o you by | Technicka Uni e zi a Os a a Au hen ica ed Download Da e | 12/10/14 3:01 PM 741 3. Own esea ch The e we e es ed moulding sands wi h hyd a ed sodi- um silica e and liquid ha dene s p epa ed in sel ha dened moulding sands echnology (es e me hod). The esea ch was conduc ed a e 24h o ha dening wi h keeping cons an em- pe a u e and humidi y in esea ch oom. The au ho s used s anda d and modi ied moulding sands wi h hyd a ed sodium silica e o p o e he necessi y o elabo a ing new me hod o knock-ou p ope ies measu emen . As a ac o modi ying es - ed moulding sands he e we e used own, pa en ed [16] addi i e called Glassex [17]. The ollowing moulding sands composi ions we e aking in o esea ch: •Sand g ains: qua z sand 100 pa s by weigh •Binde : hyd a ed sodium silica e 3 pa s by weigh •Ha dene : lodu 0,3 pa by weigh •Addi i e: Glassex 1 pa by weigh . 3.1. The es ima ion o moulding sands’ knock-ou p ope ies acco ding o Polish S anda d no PN-85/H-11005 As he i s me hod o es ima ion o moulding sands’ knock-ou p ope ies he e was used he me hod acco ding o Polish S anda d no PN-85/H-11005. The e we e es ed mould- ing sands wi h and wi hou Glassex addi i e. In he expe imen he e we e used cylind ical samples. The samples we e pu in expe imen al cas and pou ed wi h cas s eel ha ing he em- pe a u e o abou 1450◦C. A e cooling he cas s we e gen ly knocked ou he mould and he echnological knock-ou p op- e ies measu emen we e ca ied ou . The esul s a e shown in igu e 1 [18]. Fig. 1. Knock-ou p ope ies o moulding sands wi h hyd a ed sodi- um silica e wi h and wi hou Glassex addi i e measu ed by Polish S anda d no PN-85/H-11005 [18] The conduc ed esea ch shows mo e han wice educ ion o wo k necessa y o knocking he co e ou he expe imen al cas while using Glassex addi i e as a componen o moulding sand wi h hyd a ed sodium silica e. 3.2. The es ima ion o moulding sands knock-ou p ope ies acco ding o e ained s eng h R k c measu emen The cylind ical samples (p epa ed like in chap e 3.1) we e hea ed in labo a o y elec ical u nace SNOL 8,2/1100 (P) in he ange o empe a u e 100-1100◦C (e e y 100◦) and in mu le u nace FCF 7 SHM in empe a u e 1200◦C. The samples we e kep in each empe a u e o 15 min and we e cooled wi h he u nace o ambien empe a u e. Then hei e ained s eng h R k cwas measu ed using es ing machine IN- STRON con olled wi h mode n con ol sys em Tes S a IIS. The esul s a e shown in Fig. 2 [19]. Fig. 2. Knock-ou p ope ies o moulding sands wi h hyd a ed sodi- um silica e wi h and wi hou Glassex addi i e es ima ed acco ding o e ained s eng h R k cmeasu emen [19] Inse ing he Glassex addi i e o moulding sands wi h hy- d a ed sodium silica e causes change o hei e ained s eng h R k ccu e shape. The e is no 1s and 2nd maximum on he cu e. Moulding sand wi h Glassex addi i e has lowe e ained s eng h R k cin he ange o empe a u e 200-1000◦C. The in luence o Glassex addi i e on moulding sands knock-ou p ope ies was desc ibed in de ails in p e ious publica ions [19]. The au ho s p o ed ha e ained s eng h R k ccan’ be used as he c i e ia o knock-ou p ope ies es ima ion in he a ea beyond he 2nd maximum – which was desc ibed in he chap e 2.4. Tha ’s why he e is p oposed a new me hod o es ima ion o moulding sand’s knock-ou p ope ies. The me hod is based on high- empe a u e expansion measu emen . 3.3. The es ima ion o moulding sands knock-ou p ope ies acco ding o high- empe a u e expansion measu emen The e we e used cylind ical samples p epa ed and hea ed acco ding o me hods desc ibed in chap e s 3.1 and 3.2. The samples we e measu ed be o e and a e hea ing in he ange o empe a u e 600-1200◦C e e y 100◦acco ding o li e a u e da a [15, 20]. The esul s a e shown in Fig. 3 [19]. B ough o you by | Technicka Uni e zi a Os a a Au hen ica ed Download Da e | 12/10/14 3:01 PM 742 Fig. 3. Knock-ou p ope ies o moulding sands wi h hyd a ed sodi- um silica e wi h and wi hou Glassex addi i e es ima ed acco ding o high- empe a u e expansion measu emen [19] The conduc ed esea ch p o ed ha inse ing he Glassex addi i e o moulding sands wi h hyd a ed sodium silica e caus- es lowing hei high- empe a u e expansion which imp o es hei knock-ou p ope ies. In he empe a u e o 600◦C he high- empe a u e expansion is abou 50% dec eased; 700oC – abou 90%, 800◦C – abou 60%, 900◦C – abou 70%, 1100◦C – abou 50%, 1200◦C – abou 40%. The Glassex addi i e inhibi s high- empe a u e expansion o es ed moulding sands – educes hei in e nal s esses – inc easing hei knock-ou p ope ies. 4. Conclusions Acco ding o li e a u e da a and own esea ch he ollow- ing conclusions may be speci ied: 1. The me hod o es ima ing he knock-ou p ope ies o moulding sands wi h hyd a ed sodium silica e acco ding o hei e ained s eng h R k ccu e beyond he 2nd maximum is no eliable. 2. The me hod o es ima ing he knock-ou p ope ies o moulding sands wi h hyd a ed sodium silica e acco ding o hei high- empe a u e expansion measu emen seems o be much mo e eliable. 3. Inse ing he Glassex addi i e shows o e 50% inc ease o es ed moulding sands knock-ou p ope ies measu ed ac- co ding o hei high- empe a u e expansion. This is con- sis en wi h he esul s o conduc ed echnological me hod. 4. The measu emen o high- empe a u e expansion may be one o he s anda ds o es ima ing he knock-ou p ope ies o moulding sands wi h hyd a ed sodium silica e. Acknowledgemen s Scien i ic esea ch inanced om AGH, No 11.11.170.318-3. REFERENCES [1] A.E. Z a d o , Li ejnoje P oiz ods o 9, 38-39 (2000). [2] I. Va ˇ s k o a, S udium niek o ych spoji o ych sys emo o mo acich a jad o ych zmiesi o z ’ahu k ekologizacii zlie a ens a. PhD hesis, Technicka uni e zi a, Koˇ sice, Janua y 2002. [3] A. W o l , T. S e i n h a e u s e , Giesse ei 91, 6, 80-84 (2004). [4] R. G o s c h, Giesse ei Rundschau 51, 7/8, 139-142 (2004). [5] M. K o z e n i o w s k a, A. B a l i ń s k i, Ma e ialo e inzinie s o 10, 3, 291-294 (2003). [6] E. F l e m i n g, H. P o l z i n, T.J. K o o y e s, Giesse ei-P ax. 9/10, 177-183 (1996). [7] A.P. N i k i o o , A.V. A o n a s k i n, V.A. B e g m a, Li ejnoje P oiz ods o 4, 14 (1997). [8] M. S a c h o w i c z, K. G a n a , D. N o w a k, A chi es o Found y Enginee ing, Special Issue, 11, 2, 203-208 (2011). [9] K. G a n a , B. O p y d, M. S a c h o w i c z, G. J a - w o s k i, A chi es o Me allu gy and Ma e ials 58, 3, 919-922 (2013). [10] S. G o b e i s, V. A n o n o i c h, Li ejnoje P oiz ods o 8, 22-24 (2002). [11] J. D a ń k o, J. K a m i ń s k a, M. S k z y ń s k i, A chi es o Me allu gy and Ma e ials 58, 3, 993-996 (2013). [12] K.E. N e e d o , Li ejnoje P oiz ods o 1, 18-20 (2004). [13] J.L. L e w a n d o w s k i, Two zywa na o my odlewnicze, K aków 1997. [14] S .M. D o b o s z, Woda w masach o mie skich i dzeniowych, K aków 2006. [15] P. J e l i n e k, Poji o e sous a y sle a enskych o mo acich smesi, Os a a 2004. [16] Pa en PL 206691 B1: Masa o mie ska lub dzeniowa ze szkłem wodnym, udzielona 30.09.2010. [17] K. M a j o - G a b y ś, S .M. D o b o s z, A chi es o Found y Enginee ing 7, 1, 127-130 (2007). [18] S .M. D o b o s z, P. J e l i n e k, K. M a j o - G a b y ś, Chi- na Found y 8, 4, 438-446 (2011). [19] K. M a j o - G a b y ś, S .M. D o b o s z, J. J a k u b s k i, Manu ac u ing Technology 13, 1, 68-73 (2013). [20] I.S. S y ˇ c e , Li ejnoje P oiz ods o 6, 31-37 (1965). Recei ed: 10 Janua y 2014. B ough o you by | Technicka Uni e zi a Os a a Au hen ica ed Download Da e | 12/10/14 3:01 PM